Duane S. Boning: search on Z-Library

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1

[IEEE ESSCIRC 2013 - 39th European Solid State Circuits Conference - Bucharest, Romania (2013.09.16-2013.09.20)] 2013 Proceedings of the ESSCIRC (ESSCIRC) - A 12b 50MS/s 2.1mW SAR ADC with redundancy and digital background calibration

Chang, Albert H., Lee, Hae-Seung, Boning, Duane

Year:

2013

Language:

english

File:

PDF, 952 KB

english, 2013

2

Machine Learning in VLSI Computer-Aided Design || Machine Learning for VLSI Chip Testing and Semiconductor Manufacturing Process Monitoring and Improvement

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

Language:

english

File:

PDF, 551 KB

english, 2019

3

Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2015

Language:

english

File:

PDF, 4.36 MB

english, 2015

4

Machine Learning in VLSI Computer-Aided Design || A Preliminary Taxonomy for Machine Learning in VLSI CAD

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

File:

PDF, 278 KB

2019

5

A matrix math library for Java

Smith, Taber H., Gower, Aaron E., Boning, Duane S.

Journal:

Concurrency Practice and Experience

Year:

1997

Language:

english

File:

PDF, 147 KB

english, 1997

6

Modeling and simulation of stamp deflections in nanoimprint lithography: Exploiting backside grooves to enhance residual layer thickness uniformity

Hayden Taylor, Kristian Smistrup, Duane Boning

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 463 KB

english, 2011

7

[IEEE 2007 IEEE International Conference on Microelectronic Test Structures - Bunkyo-ku, Japan (2007.03.19-2007.03.22)] 2007 IEEE International Conference on Microelectronic Test Structures - Test Circuit for Study of CMOS Process Variation by Measurement of Analog Characteristics

Gettings, Karen M. G. V., Boning, Duane S.

Year:

2007

Language:

english

File:

PDF, 4.90 MB

english, 2007

8

A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers

Taylor, Hayden, Hale, Melinda, Lam, Yee Cheong, Boning, Duane

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 1.78 MB

english, 2010

9

[IEEE 2009 IEEE Custom Integrated Circuits Conference (CICC) - San Jose, CA, USA (2009.09.13-2009.09.16)] 2009 IEEE Custom Integrated Circuits Conference - Measurement and analysis of contact plug resistance variability

Balakrishnan, Karthik, Boning, Duane

Year:

2009

Language:

english

File:

PDF, 835 KB

english, 2009

10

Characterizing STI CMP Processes with an STI Test Mask Having Realistic Geometric Shapes

Xie, Xiaolin, Park, Tae, Boning, Duane, Smith, Aaron, Allard, Paul, Patel, Neil

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 262 KB

english, 2004

11

Simultaneous Fault Detection and Classification for Semiconductor Manufacturing Tools

Goodlin, Brian E., Boning, Duane S., Sawin, Herbert H., Wise, Barry M.

Journal:

Journal of The Electrochemical Society

Year:

2003

Language:

english

File:

PDF, 421 KB

english, 2003

12

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Design for Manufacturability through Design-Process Integration IV - Towards nanoimprint lithography-aware layout design checking

Taylor, Hayden, Boning, Duane, Rieger, Michael L., Thiele, Joerg

Year:

2010

Language:

english

File:

PDF, 1.10 MB

english, 2010

13

Application of Geographic Information Systems to Identify the Oversummering Regions of Blumeria graminis f. sp. tritici in China

Li, Boning, Cao, Xueren, Chen, Lin, Zhou, Yilin, Duan, Xiayu, Luo, Yong, Fitt, Bruce D. L., Xu, Xiangming, Song, Yuli, Wang, Baotong, Cao, Shiqin

Journal:

Year:

2013

Language:

english

File:

PDF, 6.49 MB

english, 2013

14

Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication

Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 5.83 MB

english, 2015

15

Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods

Lee, Brian, Boning, Duane S., Baylies, Winthrop, Poduje, Noel, Hester, Pat, Xia, Yong, Valley, John, Koliopoulus, Chris, Hetherington, Dale, Sun, HongJiang, Lacy, Michael

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 188 KB

english, 2001

16

SPIE Proceedings [SPIE Smart Materials, Nano-and Micro-Smart Systems - Melbourne, Australia (Tuesday 9 December 2008)] Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV - Modeling pattern dependencies in the micron-scale embossing of polymeric layers

Taylor, Hayden, Chiao, Jung-Chih, Hariz, Alex J., Iliescu, Ciprian, Ni, Ming, Thiel, David V., Yang, Changyi, Xing, Chen, Lam, Yee Cheong, Boning, Duane

Year:

2008

Language:

english

File:

PDF, 2.98 MB

english, 2008

17

[IEEE 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2017.5.15-2017.5.18)] 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Spin coating modeling and planarization using fill patterns for advanced packaging technologies

Lang, Christopher, Boning, Duane

Year:

2017

Language:

english

File:

PDF, 514 KB

english, 2017

18

Modeling Spin Coating over Topography and Uniformity Improvements through Fill Patterns for Advanced Packaging Technologies

Lang, Christopher I., Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2018

Language:

english

File:

PDF, 869 KB

english, 2018

19

Machine Learning in VLSI Computer-Aided Design || SiLVR: Projection Pursuit for Response Surface Modeling

Elfadel, Ibrahim M., Boning, Duane S., Li, Xin

Year:

2019

Language:

english

File:

PDF, 1.38 MB

english, 2019

20

Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating

Lang, Christopher I., Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2019

File:

PDF, 3.57 MB

2019

21

Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers

Hayden Taylor, Duane Boning, Ciprian Iliescu, Bangtao Chen

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 594 KB

english, 2008

22

Three-dimensional profile stitching based on the fiducial markers for microfluidic devices

Zhiguang Xu, Shiguang Li, Daniel J. Burns, Vijay Shilpiekandula, Hayden K. Taylor, Soon Fatt Yoon, Kamal Youcef-Toumi, Ivan Reading, Zhongping Fang, Jianhong Zhao, Duane S. Boning

Journal:

Optics Communications

Year:

2009

Language:

english

File:

PDF, 977 KB

english, 2009

23

Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, Leonard Borucki, Yun Zhuang, Sudhanshu Misra, Karey Holland, Duane Boning, Ara Philipossian

Journal:

Thin Solid Films

Year:

2009

Language:

english

File:

PDF, 723 KB

english, 2009

24

Large-area and high-resolution distortion measurement based on moiré fringe method for hot embossing process

Xu, Zhiguang, Taylor, Hayden K., Boning, Duane S., Yoon, Soon Fatt, Youcef-Toumi, Kamal

Journal:

Year:

2009

Language:

english

File:

PDF, 1.49 MB

english, 2009

25

Sa1964 Gastric Cancer Chemoprevention by Phenethyl Isothiocyanate-Containing Diet in Chemically – but Not Genetically – Induced Gastric Cancer in Mice

Øverby, Anders, Zhao, Chun-Mei, Wang, Timothy C., Bones, Atle, Chen, Duan

Journal:

Gastroenterology

Year:

2014

Language:

english

File:

PDF, 45 KB

english, 2014

26

[IEEE 2011 International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2011.03.14-2011.03.16)] 2011 12th International Symposium on Quality Electronic Design - A simple array-based test structure for the AC variability characterization of MOSFETs

Balakrishnan, Karthik, Jenkins, Keith A., Boning, Duane

Year:

2011

Language:

english

File:

PDF, 1.12 MB

english, 2011

27

Pattern Based Prediction for Plasma Etch

Abrokwah, Kwaku O., Chidambaram, P. R., Boning, Duane S.

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.55 MB

english, 2007

28

Characterizing and Predicting Spatial Nonuniformity in the Deep Reactive Ion Etching of Silicon

Taylor, Hayden K., Sun, Hongwei, Hill, Tyrone F., Farahanchi, Ali, Boning, Duane S.

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 513 KB

english, 2006

29

[IEEE Conference Publications Design Automation and Test in Europe - Grenoble, France (2013.03.18-2013.03.22)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013 - Statistical Modeling with the Virtual Source MOSFET Model

Yu, Li, Wei, Lan, Antoniadis, Dimitri, Elfadel, Ibrahim, Boning, Duane

Year:

2013

Language:

english

File:

PDF, 1.39 MB

english, 2013

30

[IEEE 2012 IEEE International Conference on IC Design & Technology (ICICDT) - Austin, TX, USA (2012.05.30-2012.06.1)] 2012 IEEE International Conference on IC Design & Technology - Spatial variation decomposition via sparse regression

Zhang, Wangyang, Balakrishnan, Karthik, Li, Xin, Boning, Duane, Acar, Emrah, Liu, Frank, Rutenbar, Rob A.

Year:

2012

Language:

english

File:

PDF, 2.39 MB

english, 2012

31

Lack of Spatial Correlation in MOSFET Threshold Voltage Variation and Implications for Voltage Scaling

Drego, Nigel, Chandrakasan, Anantha, Boning, Duane

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2009

Language:

english

File:

PDF, 1024 KB

english, 2009

32

[IEEE 2012 13th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2012.03.19-2012.03.21)] Thirteenth International Symposium on Quality Electronic Design (ISQED) - Test structure, circuits and extraction methods to determine the radius of infuence of STI and polysilicon pattern density

Chang, Albert H., Zuo, Kewei, Wang, Jean, Yu, Douglas, Boning, Duane

Year:

2012

Language:

english

File:

PDF, 2.90 MB

english, 2012

33

[IEEE 2012 13th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2012.03.19-2012.03.21)] Thirteenth International Symposium on Quality Electronic Design (ISQED) - Methodology for analysis of TSV stress induced transistor variation and circuit performance

Yu, Li, Chang, Wen-Yao, Zuo, Kewei, Wang, Jean, Yu, Douglas, Boning, Duane

Year:

2012

Language:

english

File:

PDF, 1.67 MB

english, 2012

34

Variation

Boning, Duane S., Balakrishnan, Karthik, Cai, Hong, Drego, Nigel, Farahanchi, Ali, Gettings, Karen M., Lim, Daihyun, Somani, Ajay, Taylor, Hayden, Truque, Daniel, Xie, Xiaolin

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2008

Language:

english

File:

PDF, 2.28 MB

english, 2008

35

[IEEE 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers - San Francisco, CA, USA (2007.02.11-2007.02.15)] 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers - Performance Variability of a 90GHz Static CML Frequency Divider in 65nm SOI CMOS

Lim, Daihyun, Kim, Jonghae, Plouchart, Jean-Olivier, Cho, Choongyeun, Kim, Daeik, Trzcinski, Robert, Boning, Duane

Year:

2007

Language:

english

File:

PDF, 3.10 MB

english, 2007

36

[IEEE 2007 International Workshop on Physics of Semiconductor Devices - Mumbai, India (2007.12.16-2007.12.20)] 2007 International Workshop on Physics of Semiconductor Devices - Parametric yield analysis on FEM based microsystem designs

Shyam Praveen Vudathu,, Umamaheswara Reddy Vemulapati,, Boning, Duane, Ramanolla, Vasudevarao, Laur, Rainer, Silber, Dieter

Year:

2007

Language:

english

File:

PDF, 189 KB

english, 2007

37

[IEEE 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - San Jose, CA, USA (2011.11.7-2011.11.10)] 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - Toward efficient spatial variation decomposition via sparse regression

Zhang, Wangyang, Balakrishnan, Karthik, Li, Xin, Boning, Duane, Rutenbar, Rob

Year:

2011

Language:

english

File:

PDF, 2.91 MB

english, 2011

38

[IEEE 2007 IEEE Radio Frequency Integrated Circuits Symposium - Honolulu, HI, USA (2007.06.3-2007.06.5)] 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Performance and Yield Optimization of mm-Wave PLL Front-End in 65nm SOI CMOS

Lim, Daihyun, Kim, Jonghae, Plouchart, Jean-Olivier, Kim, Daeik, Cho, Choongyeun, Boning, Duane S.

Year:

2007

Language:

english

File:

PDF, 4.12 MB

english, 2007

39

[IEEE 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - Phoenix, AZ, USA (2007.04.15-2007.04.19)] 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - A Critical Enhancement in the Yield Analysis of Microsystems

Vudathu, Shyam Praveen, Boning, Duane, Laur, Rainer

Year:

2007

Language:

english

File:

PDF, 447 KB

english, 2007

40

[IEEE Conference Publications Design Automation and Test in Europe - Dresden, Germany (2014.03.24-2014.03.28)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014 - Efficient performance estimation with very small sample size via physical subspace projection and maximum a posteriori estimation

Yu, Li, Saxena, Sharad, Hess, Christopher, Elfadel, Ibrahim Abe M., Antoniadis, Dimitri, Boning, Duane

Year:

2014

Language:

english

File:

PDF, 526 KB

english, 2014

41

[IEEE 2008 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Fukuoka, Japan (2008.11.3-2008.11.5)] 2008 IEEE Asian Solid-State Circuits Conference - An all-digital, highly scalable architecture for measurement of spatial variation in digital circuits

Drego, Nigel, Chandrakasan, Anantha, Boning, Duane

Year:

2008

Language:

english

File:

PDF, 223 KB

english, 2008

42

[IEEE 8th International Symposium on Quality Electronic Design (ISQED'07) - San Jose, CA, USA (2007.03.26-2007.03.28)] 8th International Symposium on Quality Electronic Design (ISQED'07) - Variation

Boning, Duane, Balakrishnan, Karthik, Cai, Hong, Drego, Nigel, Farahanchi, Ali, Gettings, Karen, Lim, Daihyun, Somani, Ajay, Taylor, Hayden, Truque, Daniel, Xie, Xiaolin

Year:

2007

Language:

english

File:

PDF, 626 KB

english, 2007

43

[IEEE 8th International Symposium on Quality Electronic Design (ISQED'07) - San Jose, CA, USA (2007.03.26-2007.03.28)] 8th International Symposium on Quality Electronic Design (ISQED'07) - A Test-Structure to Efficiently Study Threshold-Voltage Variation in Large MOSFET Arrays

Drego, Nigel, Chandrakasan, Anantha, Boning, Duane

Year:

2007

Language:

english

File:

PDF, 457 KB

english, 2007

44

[IEEE 2014 IEEE International Ultrasonics Symposium (IUS) - Chicago, IL, USA (2014.9.3-2014.9.6)] 2014 IEEE International Ultrasonics Symposium - Towards wireless capsule endoscopic ultrasound (WCEU)

Lee, John H., Traverso, Giovanni, Schoellhammer, Carl M., Blankschtein, Daniel, Langer, Robert, Thomenius, Kai E., Boning, Duane S., Anthony, Brian W.

Year:

2014

Language:

english

File:

PDF, 712 KB

english, 2014

45

[IEEE 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS) - Abu Dhabi, United Arab Emirates (2013.12.8-2013.12.11)] 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS) - Variability analysis of a 28nm near-threshold synchronous voltage converter

Tekeste, Temesghen, Shabra, Ayman, Boning, Duane, Elfadel, Ibramim

Year:

2013

Language:

english

File:

PDF, 745 KB

english, 2013

46

An investigation of the detrimental impact of trapped air in thermoplastic micro-embossing

Taylor, Hayden, Lam, Yee Cheong, Boning, Duane

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 1.41 MB

english, 2010

47

Coherent Chip-Scale Modeling for Copper CMP Pattern Dependence

Cai, Hong, Park, Tae, Boning, Duane, Kim, Hyungjun, Kang, Youngsoo, Kim, Sibum, Lee, Jeong-Gun

Journal:

MRS Proceedings

Year:

2004

Language:

english

File:

PDF, 353 KB

english, 2004

48

[IEEE 2015 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2015.2.22-2015.2.26)] 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers - 15.6 12b 250MS/S pipelined ADC with virtual ground reference buffers

Boo, Hyun H., Boning, Duane S., Lee, Hae-Seung

Year:

2015

Language:

english

File:

PDF, 644 KB

english, 2015

49

Nanotopography Issues in Shallow Trench Isolation CMP

Boning, Duane, Lee, Brian

Journal:

Year:

2002

Language:

english

File:

PDF, 693 KB

english, 2002

50

CMP at the Wafer Edge – Modeling the Interaction between Wafer Edge Geometry and Polish Performance

Xie, Xiaolin, Boning, Duane

Journal:

MRS Proceedings

Year:

2005

Language:

english

File:

PDF, 284 KB

english, 2005

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